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ABOUT US

Focus on We specialize in the development, production, and sale of advanced chemical solutions for all critical PCB processes

Nantong Chemax Electronic Materials Co., LTD., as an electronic chemicals supplier, has been engaged in formula research and development, production and sales of chemical solutions for various PCB processes (including micro-etching, film removal, cleaning, etc.) since 2006, and provides customers with comprehensive and considerate services. The company is located in the Chemical Industry Park of Nantong Development Zone, covering an area of 30 mu, with a total construction area of approximately 12,000 square meters.

  • 20 +
    With over 20 years of specialization in electronic materials.
  • 12000
    The total construction area is about 12000 square meters
  • 20000
    Annual production capacity of 20000 tons

Products

Membrane-removing systems

It covers two major categories: inorganic film removal solution and organic film removal solution.
It covers two major categories: inorganic film removal solution and organic film removal solution. The company's current portfolio of inorganic and organic film removal solutions can fully cover the entire PCB manufacturing process scenarios. It not only meets the strict standards of high-end processes but also efficiently solves the diverse technical problems of customers.
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Micro-etching, etching type/stabilizers

The company's micro-etching solution specializes in copper surface etching and circuit manufacturing
The company's micro-etching solution specializes in copper surface etching and circuit manufacturing processes, capable of achieving excellent linear control effects and precisely matching the demands of high-end processes such as MSAP and SAP.
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Copper surface roughening agent

By means of chemical methods, a micro-rough structure is constructed on the surface of copper, effec
By means of chemical methods, a micro-rough structure is constructed on the surface of copper, effectively increasing the surface area of copper, forming an ideal roughness and flowering density, and significantly enhancing the adhesion between the copper layer and the dry film as well as the ink.
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Encapsulation class

The company has launched a series of chemicals including film removal solutions, micro-etching solut
The company has launched a series of chemicals including film removal solutions, micro-etching solutions, titanium etching solutions and de-gumming agents, providing comprehensive surface treatment solutions for packaging processes.
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Eching resist agent

It is suitable for the tenting process and can significantly increase the etching factor of the circ
It is suitable for the tenting process and can significantly increase the etching factor of the circuit after acidic etching, facilitating the precise production of fine circuits.
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SHIKOKU OSP/GliCAP

The OSP solution of Shikoku Chemical represented by the company can form a heat-resistant protective
The OSP solution of Shikoku Chemical represented by the company can form a heat-resistant protective film on the copper surface, ensuring excellent solderability. GLICAP solution enhances the adhesion between copper and resin through chemical film formation, and the two work together to provide a reliable surface treatment solution for high-density interconnection processes.
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LC-2030 Liquid Chromatograph

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Laboratory

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Laboratory

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Ultra-depth-of-field 3D metallographic microscope

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TOC-2000 Total Organic Carbon analyzer

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CVS analyzer

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Metallographic microscope

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White light interferometer

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SU-5000 electronic scanner

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LC-2030 Liquid Chromatograph

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Laboratory

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Laboratory

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Ultra-depth-of-field 3D metallographic microscope

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TOC-2000 Total Organic Carbon analyzer

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CVS analyzer

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Metallographic microscope

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White light interferometer

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SU-5000 electronic scanner

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